3 reasons why AIKO ABC modules are more resistant to microcracks

AIKO, a recognized leader in solar panels with a prestigious BloombergNEF Tier 1 ranking, has developed a comprehensive approach to reduce microcracks in its N-type ABC PV modules. By combining advanced single-sided soldering, silver-free metallization and optimized mechanical (tensile) design, the structure significantly reduces the likelihood of microcracks and promotes high reliability as well as long-term durability.

What are microcracks?

Microcracks are tiny cracks in the crystalline silicon that occur during transport and installation (impact, bending) and operation (temperature cycling, wind, snow). They deactivate parts of the cell, increase local resistance and can cause hot spots. Constructions that limit stress concentrations and deflection of the module therefore inhibit both the formation and propagation of microcracks.

Single-sided soldering in all-back-contact arrangement

Conventional front-to-back architectures use Z-bends of solder strips and mixed front/rear contacts – common voltage concentration points. The AIKO ABC layout draws current exclusively from the rear and uses straight, linear connections on only one side of the cell. With no front bus bars and fewer “notches”, the mechanical and thermal loads are more evenly distributed, so the peak voltage drops during bending or point loading.

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Metallization without silver

Screen printed silver pastes create porous, relatively brittle conductors and require high temperature firing. AIKO replaces them with metallic copper plating on the back side. A denser, more homogeneous conductor with stronger adhesion better resists fatigue during thermal cycling and bending, so it maintains stable electrical contact even in areas where microcracks typically occur.

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Optimised power transmission and glass-glass mechanics

In addition to the interconnection of the cells, the mechanics of the module also determines the risk of microcracks. AIKO’s tensile design tunes the strip geometry and voltage flows to minimize spikes in silicon reflow. Glass-glass designs with thicker glass play a role in module composition, increasing bending stiffness and reducing deflection – key to preventing crack nucleation. Impact tests confirm this: the ABC mono-glass (3.2 mm) is certified to hail 40 mm, the ABC glass-glass (2.0 mm) to 35 mm, while typical TOPCon glass-glass (1.6 mm) reaches about 25 mm.

What it means in practice

Synergy of elements

Back, straight, fracture-free connections + fatigue-resistant copper metallization + stiffer glass-glass = less initiation and propagation of microcracks.

Handling and assembly

Higher tolerance to minor impacts and local pressure (correct procedures still required).

Operation and weather

More stable behaviour in wind/snow and temperature fluctuations; strong hail resistance in line with thicker windscreen.

Life cycle

Fewer hotspots, better current alignment in the string and slower defect growth on EL frames – more stable yield and less O&M intervention.

AIKO ABC panel design thus addresses micro-cracks directly in the cell design, its metallization and module mechanics, delivering glass-glass modules that maintain electrical integrity from delivery and installation to years of operation.